Sign In | Join Free | My carsrow.com
China Shenzhen Xinchenger Electronic Co.,Ltd logo
Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
Site Member

10 Years

Home > Rogers PCB >

Half Hole HDI Rogers PCB Ro3003 Multilayer Circuit Board Fabrication Green or White

Shenzhen Xinchenger Electronic Co.,Ltd
Contact Now

Half Hole HDI Rogers PCB Ro3003 Multilayer Circuit Board Fabrication Green or White

  • 1
  • 2

Brand Name : XCE

Model Number : XCER

Certification : CE,ROHS, FCC,ISO9008

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : Rogers3003

Color : green/white

Layer : 4

Origin : China

Contact Now

Half Hole High Frequency Rogers PCB Ro3003 Multilayer Circuit Board

Specification

Size: 10*2cm Origin: Shenzhen,China
Model: XCER Number of layer: 4
Solder mask: green Silk screen: white
Surface finish: HASL Cu thickness: 2OZ
Min line space: 5mil Mil line width: 5mil

Quick details:

Quote as your detail information(like layer, material raw,board thickness&size,copper thickness)

It's better to send us gerber file,then can get accurate price.

Send you quotation within 24 hours,then you can confirm it.

If our price approved by you,then arrange the payment

Once we got the payment,we will made the production.

Generally 2/4 layer pcb 3-5 days,more then 6 layer 7-10 days

Parameter

Board thickness tolerance   T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating


Service:


1. pcb design and pcb layout;

2.pcb manufacturing;
3. electronic components procurement;
4. pcb assembly & pcba manufacturing;
5. functional testing.


Product Tags:

Pcb Board Prototype

      

Printing Circuit Boards

      
 Half Hole HDI Rogers PCB Ro3003 Multilayer Circuit Board Fabrication Green or White Manufactures

Half Hole HDI Rogers PCB Ro3003 Multilayer Circuit Board Fabrication Green or White Images

Inquiry Cart 0
Send your message to this supplier
 
*From:
*To: Shenzhen Xinchenger Electronic Co.,Ltd
*Subject:
*Message:
Characters Remaining: (0/3000)