With ENIG Finished Surface In 0.79mm Rogers And FR4 Mixed 4 layer pcb Board In Green Soldermask
Quick detail:
| Origin:China |
Special: High frequency pcb |
| Layer:4 |
Thickness:0.79mm |
| Surface: ENIG |
Hole:0.2 |
Specification:
High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and high power RF designs.
For a long time, most of the domestic application is made glass cloth PTFE CCL. But because of its single species, the dielectric properties of poor uniformity, has become increasingly unsuited to some of the high performance requirements of the occasion. After the 1990s, the United States produced by Rogers RT / Duroid series, TMM series and RO series microwave base plate gradually applied, mainly glass fiber reinforced PTFE laminates, ceramic-filled PTFE powder CCL and ceramic powder filled thermosetting resin CCL, although expensive, but its excellent dielectric properties and mechanical properties of domestic microwave PCB substrate still has a considerable advantage
The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component.
Depending on various parameters, HF signals are reflected on circuit board, meaning that theimpedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control.
RF multilayer mixed plate manufacturing, may experience the traditional multilayer FR-4 PCB manufacturers, using existing multilayer PCB lamination manufacturing equipment, in full consideration of the interlayer targeting the premise, there is targeted manner. Thus, not only can effectively achieve the interconnection between layers, and can satisfy the design requirements. In addition, unlike traditional laminated multilayer PCB manufacturing is different, in the lamination process, the need to draw on the material properties and businesses to provide the appropriate prepreg lamination process control parameters is recommended, it can play a guiding role
Parameter:
| o |
Item |
Data |
| 1 |
Layer: |
1 to 24 layers |
| 2 |
Material type: |
FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers |
| 3 |
Board thickness: |
0.20mm to 3.4mm |
| 4 |
Copper thickness: |
0.5 OZ to 4 OZ |
| 5 |
Copper thickness in hole: |
>25.0 um (>1mil) |
| 6 |
Max. Board Size: |
(580mm×1200mm) |
| 7 |
Min. Drilled Hole Size: |
4mil(0.1mm) |
| 8 |
Min. Line Width: |
3mil (0.075mm) |
| 9 |
Min. Line Spacing: |
3mil (0.075mm) |
| 10 |
Surface finishing: |
HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating |
| 11 |
Solder Mask Color: |
Green/Yellow/Black/White/Red/Blue |
| 12 |
Shape tolerance: |
±0.13 |
| 13 |
Hole tolerance: |
PTH: ±0.076 NPTH: ±0.05 |
| 14 |
Package: |
Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing |
| 15 |
Certificate: |
UL,SGS,ISO 9001:2008 |
| 16 |
Special requirements: |
Buried and blind vias+controlled impedance +BGA |
| 17 |
Profiling: |
Punching, Routing, V-CUT, Beveling |
Features
• High Thermal Performance
Tg: 180°C (DSC)
Td: 340°C (TGA @ 5% wt loss)
Low CTE for reliability
• T260: 60 minutes
• T288: 30 minutes
• RoHS Compliant
• UV Blocking and AOI Fluorescence
High throughput and accuracy during PCB
fabrication and assembly
• Superior Processing
Closest to conventional FR-4 processing
• Core Material Standard Availability
Thickness: 0.002″ (0.05 mm) to 0.125″
(3.2 mm)
Available in full size sheet or panel form
• Prepreg Standard Availability
Roll or panel form
Tooling of prepreg panels available
• Copper Foil Type Availability
Standard HTE Grade 3
RTF (Reverse Treat Foil)
• Copper Weights
½, 1 and 2 oz (18, 35 and 70 μm) available
Heavier copper available upon request
Thinner copper foil available upon request
• Glass Fabric Availability
Standard E-glass
Square weave glass fabric available
Spread glass fabric available
• Industry Approvals
IPC-4101C /21 /24 /26 /97 /98 /99 /101 /126
UL - File Number E41625 as PCL-FR-370HR
Qualified to UL's MCIL Program
Rogers material in stock:
| Brand |
Model |
Thickness(mm) |
DK(ER) |
| F4B |
F4B |
0.38 |
2.2 |
| F4B |
0.55 |
2.23 |
| F4B |
0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 |
2.65 |
| F4Bk |
0.8,1.5 |
2.65 |
| F4B |
0.8 |
3.5 |
| FE=F4BM |
1 |
2.2 |
| Rogers |
RO4003 |
0.254 0.508,0.813,1.524 |
3.38 |
| RO4350 |
0.254 0.508,0.762,1.524 |
3.5 |
| RO5880 |
0.254.0.508.0.762 |
2.2 |
| RO3003 |
0.127,0.508,0.762,1.524 |
3 |
| RO3010 |
0.635 |
10.2 |
| RO3206 |
0.635MM |
10.2 |
| R03035 |
0.508MM |
3.5 |
| RO6010 |
0.635MM, 1,27MM |
10.2 |
Product Tags:
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ENIG Finished Surface In 0.79mm Rogers And FR4 Mixed 4 layer pcb Board In Green Soldermask Images
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