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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Double Side Rogers4350B ENIG Circuit Board 2 Layer PCB For Splitter

Shenzhen Xinchenger Electronic Co.,Ltd
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Double Side Rogers4350B ENIG Circuit Board 2 Layer PCB For Splitter

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : Rogers

Layer : 2

Min line space : 5mil

Min line width : 5mil

Copper thickness : 1OZ

Board size : 66*66mm

Panel : 1

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This is a type of RO4350B PCB for the application of Splitter. It's a 2 layer board at 0.9mm thick.

The base laminate is from Rogers Corp.. Solder mask and silkscreen from Taiyo. It's fabricated

per IPC 6012 Class 2 using supplied Gerber data. Each 10 boards or panels are packed separately.

Welcome to ShenZhen Xinchenger Electronics Co.,Ltd

ShenZhen Xinchenger Electronics Co.,Ltd is an professional PCB Board Manufacturer since 2000, owns 3 modern Printed Circuit Board factories in Guangdong, China. With over 18 years experience, we offer OEM & ODM PCB Layout, PCB Design, PCB manufacturing, PCB Assembly and PCB Copy in single-sided PCB Board, double-sided PCB and Multilayer Printed Circuit Board service to our customers, with total production capacity of 290,000 sqm/month.

Our One-Stop Service for PCB & PCB Assembly manufacturing:

1. Quick Quotation - Competitive factory direct price is always offered

2. Free Sample - Sample for free before mass production

3. Quality Control - Complete test procedure is necessary

4. On Time Delivery - Customize the logistics plan according to customer's requirement

5. After-sale Service - Reply to the claim within 24 hours to make sure our customer's manufacturing

Technical Capabilities

Items Speci. Remark
Max panel size 32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz
Outer copper thickness 0.5~6 oz
Finished board thickness 0.4-3.2 mm

Board thickness tolerance control
±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation
Layer count Capability 1-30 LAYER
alignment between ML ±2mil
Min drilling 0.15 mm
Min finished hole 0.1 mm
Hole precision ±2 mil(±50 um)
tolerance for Slot ±3 mil(±75 um)
tolerance for PTH ±3 mil(±75um)
tolerance for NPTH ±2mil(±50um)
Max Aspect Ratio for PTH 8:1
Hole wall copper thickness 15-50um
Alignment of outer layers 4mil/4mil
Min trace width/space for outer layer 4mil/4mil
Tolerance of Etching +/-10%
Thickness of solder mask on trace 0.4-1.2mil(10-30um)
at trace corner ≥0.2mil(5um)
On base material ≤+1.2mil
Finished thickness
Hardness of solder mask 6H
Alignment of solder mask film ±2mil(+/-50um)
Min width of solder mask bridge 4mil(100um)
Max hole with solder plug 0.5mm
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger 280u"(7um)
Max gold thickness for Gold finger 30u"(0.75um)
Nickel thickness in Immersion Gold 120u"/240u"(3um/6um)
Gold thickness in Immersion Gold 2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance 50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength ≥61B/in(≥107g/mm)
bow and twist 0.75%


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 Double Side Rogers4350B ENIG Circuit Board 2 Layer PCB For Splitter Manufactures

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