Sign In | Join Free | My carsrow.com |
|
Brand Name : XCE
Model Number : XCEM
Certification : CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : 1pcs
Price : negotiation
Payment Terms : T/T,Western union
Supply Ability : 1, 000, 000 PCS / week
Delivery Time : 5-10 days
Packaging Details : inner: vacuum-packed bubble bag outer: carton box
Material : Rogers
Layer : 2
Color : White
Min line space : 5mil
Min line width : 5mil
Copper thickness : 1OZ
Board size : 65*165mm
Panel : 1
Surface : Immersion Gold
60GHz Development System Rogers Board With Green Soldermask 2 Layer Laminated Structure
Key Specifications/Special Features:
PCB features:
Layer: 2
Material: Rogers
Thickness: 1.524mm
Copper: 1oz
Mini hole: 0.2mm
Mini width/space: 0.2mm/0.2mm
Finish: immersion Gold
Specifiction:
layer:2
board thickness:1.524mm
Copper thickness:1oz
min Hole size:0.2mm
min line width and distance:10/10mil
Surface treatment: imersion gold
Application: 60GHz Development System
Product Description
L1-L2 Blind holes;
L2-L3 Bury holes;
L1-L4 Through holes;
Copper based with Rogers 4003 T1.3mm.
Copper thickness 0.70mm;
Milling thickness 1.2mm.
Specification
PCB Type: | Rogers PCB |
Layer : | 2 layer |
Min .Line Width/Space: | 3mil/3mil |
Min. Via Diameter: | 0.3mm |
Finish Thickness: | 0.2mm |
Surface Finish: | ENIG |
Size: | 65*165MM |
Material: | Rogers |
Color: | White |
Application: | aviation |
60GHz Development System Rogers Board With Green Soldermask 2 Layer Laminated Structure
Available substrates:
RO4350B RO4003C TLX-8 (TACONIC) F4B Woven Glass-Reinforced PTFE
4mil(0.1mm) 8mil (0.203mm) 20mil(0.5mm)
10mil(0.254mm) 12mil(0.3mm) 30mil(0.762mm)
13.3mil(0.338mm) 20mil(0.508mm) 40mil(1.0mm)
20mil (0.508mm) 32mil(0.813mm)
30mil(0.762mm) 60mil(1.524mm)
60mil(1.524mm)
Specification:
High frequency pcb high-performance insulating material for microwave, radio frequency (RF) and high-speed digital signal processing (DSP) market with PTFE/type woven glass fiber fabric sheet.This material can be applied to LNAs LNBs, PCS/PCN antenna system, global positioning system (GPS) and UMTS antenna system,And the power amplifier, passive components, collision avoidance radar system, aviation help guide remote control technology and system of the phased array radar.
High frequency materials are UL 94V-0 rated for active devices and high power RF designs.
Why us:
1 Iso 9001,14001,TS16949,UL Certified.
2 900+staff,registered capital USD1.68million.
3 Full-process workshop-lamination workshop,imersion gold workshop,AOI test
UL (E246887), ISO9001, TS16949, ISO 14001 certified.
Turnover USD 50-100 million per year
25,000 sqm area,900+ staff
Mass Production from single to 20 layers
Special Material: ROGERS, Arlon, Taconic.etc.
Client: SAMSUNG, Skyworth, Malata, Midea.etc.
Description :
RO3003™ high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability at competitive prices.
RO3003 excellent stability of dielectric constant over temperature including the elimination of the step change in dielectric constant, which occurs near room temperature with PTFE glass materials. Additionally, RO3003 laminates exhibit a low dissipation factor of 0.0013 at 10 GhZ.
![]() |
60GHz Development System Rogers 2 Layer Board Laminated With Green Soldermask Images |